GLASS EPOXY COPPER CLAD LAMINATE

Composite epoxy copper clad laminate is made by pressing fiber glass with different base materials (insulation paper or fiber glass mat) that are impregnated with epoxy resin. It offers the advantages of low price and is suitable for punching processing. It is generally used in home appliances, IT peripherals, consumer electronics and communication electronic products.

LED

LCD TV backlight and LED lighting electronics.

Home appliance

LED TV, air conditioners, refrigerators, washing machines and other household electronic products.

Computers and consumer electronics

Display, keyboard, mouse and power supply.

Vehicle board

Auto dashboard, electric rear-view mirror, car audio.

CEM-1 (UL94 V-0) CCP-508 series

1. CCP-508: yellow, suitable for wave soldering process.

2. CCP-508(W): white, suitable for wave soldering process.

3. CCP-508(S): light yellow, CTI>600V, suitable for high humidity environment, and for wave soldering process.

4. CCP-508(SW): white, CTI>600V, suitable for high humidity environment, and for reflow soldering process.

CEM-1 (UL94 V-0) (halogen-free) CCP-518 series

1. CCP-518: yellow, CTI>600V, suitable for high humidity environment, and for wave soldering process.

2. CCP-518(SW): white, CTI>600V, suitable for high humidity environment, and for reflow soldering process.

CEM-3 (UL94 V-0) CCP-308 series

1. CCP-308: yellow, CTI>600V, suitable for high humidity environment, and for reflow soldering process.

2. CCP-308(C): semitransparent, CTI>600V, suitable for high humidity environment, and for reflow soldering and copper through-hole technologies.

3. CCP-308(N): yellow, CTI>600V, excellent thermal conductivity of K=1.0W/mk, suitable for high humidity environment, and for reflow soldering process.

4. CCP-308(TC): white, CTI>600V, excellent thermal conductivity of K=1.5W/mk, suitable for high humidity environment, and for reflow soldering process.

CEM-3 (UL94 V-0) (halogen-free) CCP-308(G) series

1. CCP-308(G): yellow, CTI>600V, excellent thermal conductivity of K=1.0W/mk, suitable for high humidity environment, and for reflow soldering process.

2. CCP-308(TCG): white, CTI>600V, excellent thermal conductivity of K=1.5W/mk, suitable for high humidity environment, and for reflow soldering process.